1. Metoda de inspecție prin observare: Metoda de inspecție prin observație se referă la metoda de inspectare a defecțiunilor prin observarea aspectului plăcii de bază a computerului cu panou industrial și dacă componentele sunt anormale.
When repairing the industrial motherboard, observe whether the capacitor on the industrial motherboard is bulging, leaking or severely damaged; whether the resistor and capacitor pins touch, whether the surface is burnt, whether the chip surface is cracked, and whether the copper foil is burned. Check whether the plugs and sockets are skewed; check whether foreign objects have fallen between the components of the industrial motherboard; check whether the chip is abnormally hot.
2. Comparison method: The comparison method is a simple and easy maintenance method. Prepare motherboards of the same model as the faulty industrial motherboard during maintenance. When certain modules are suspected, test the same test points of the two motherboards separately, and use the correct one. Compare the characteristics (waveform or voltage) with the faulty motherboard to see which module's waveform or voltage does not match, and then check the inconsistencies point by point until the fault is found and resolved.
3. Measurement method: The measurement method includes resistance measurement method and voltage measurement method.
The resistance measurement method is to use the method of measuring the resistance value to roughly judge the quality of industrial motherboard chips and electronic components, as well as to judge the serious short circuit and open circuit of the circuit. For example, use the diode file to measure whether the transistor has a serious short circuit or open circuit to judge its quality, or measure the resistance of the ISA slot to the ground to judge the quality of the South Bridge chip.
The voltage measurement method is mainly to measure the voltage and compare it with the test points of the normal industrial motherboard to find out the test points with differences, follow the line (running circuit) of the test points to find the faulty components and eliminate the fault.
4. Replacement method: Replacement method is to replace the suspected component with a good component. If the fault disappears, it means that the suspicion is correct, otherwise it is a judgment error, and further inspection and judgment should be made.
V. Temperature rise and fall method: The rise and fall temperature method is mainly aimed at the situation where the motherboard of an industrial tablet computer is caused by the poor thermal stability of a certain component. When the temperature rise of the suspected component is abnormal and can be sensed, use the cooling method to force it to cool down. If the fault disappears or tends to reduce, it can be judged that the component has thermal failure. When the fault occurs after a long period of power-on or the fault occurs with seasonal changes, heat the suspected component with a temperature increase method to increase the temperature. If the fault occurs subsequently, it can be judged that its thermal stability is poor.
6. Clean inspection method: The clean inspection method is suitable for the complicated working environment of industrial tablet computers, and it is suspected that the industrial motherboard may malfunction due to dust, etc. When cleaning, you can use a brush to gently brush away the dust on the industrial motherboard. In addition, some plug-in cards and chips on industrial motherboards are in the form of pins, which often lead to poor contact due to oxidation of the pins. You can use an eraser to remove the surface oxide layer and reconnect.
