Small-pitch LED displays are very popular in the current market and are widely used in various fields. They act as high-definition large-screen display devices and serve people. Today, Winbond Ying editor will take you to understand Several packaging technologies for pitch LED displays.
Small pitch LED display
1. Surface mount (SMD)
The surface mount (SMD) package is to solder single or multiple LED chips on a metal bracket with a plastic "cup" outer frame (the outer pins of the bracket are connected to the P and N levels of the LED chip respectively). It is potted with liquid epoxy resin or organic silicone, then baked at high temperature, and then cut and separated into individual surface mount packaged devices.
2. The new integrated packaging technology IMD (four in one)
LED display companies have a deep technical accumulation of SMD placement process, and the "four-in-one" package is a further development based on the inheritance of SMD packaging. The SMD package contains one pixel in one package structure, while the "four-in-one" package contains four pixels in one package structure. Although the four-in-one LED display adopts the new integrated packaging technology IMD (four-in-one), the surface mount technology is still used in the process.
The "four-in-one" Mini LED module IMD package combines the advantages of SMD and COB, and solves the problems of ink color consistency, splicing, light leakage, and maintenance. It has the characteristics of high contrast, high integration, easy maintenance, and low cost. It is a better compromise on the road to smaller spacing. At present, "four-in-one" Mini LED modules use formal chips for cost considerations. As packaging manufacturers make more requirements for chips, they will further introduce "six-in-one" or even "N-in-one". "plan.
Small pitch LED display
3. COB packaging technology
COB packaging is a way of attaching the bare chip to the interconnect substrate with conductive or non-conductive glue, and then performing wire bonding to realize its electrical connection. COB packaging uses integrated packaging technology, because it saves a single LED device, and then mounts the process after packaging. It can effectively solve the problems of SMD packaged display screens, because the dot pitch is shrinking, the process difficulty is increased, the yield rate is reduced, and the cost is increased. COB is easier to achieve small pitches.
